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02/15/2008 - 13:13 ET IEC Wraps Up DesignCon 2008 with Record-Breaking Attendance from Design Engineers, Exhibitors and Media 02/06/2008 - 09:17 ET LeCroy Receives PCI-SIG Approval for PCI-Express Gen 2 Compliance Solution 02/05/2008 - 13:31 ET Tektronix Provides First Fully Automated Compliance Test Suite for Serial ATA Gen-2 Physical Layer 02/05/2008 - 13:30 ET Tektronix Builds Serial ATA Compliance Test Solution Using NI TestStand 02/05/2008 - 08:00 ET GORE DEMONSTRATES NEXT GENERATION ACTIVE COPPER INTERCONNECTS FOR FUTURE DATA CENTER APPLICATIONS 02/05/2008 - 03:05 ET Altium's extended range of NanoBoards opens up new hardware possibilities 02/05/2008 - 03:05 ET "Sustainable innovation the only way to long-term success, device intelligence the future of electronics design" 02/05/2008 - 03:05 ET Turning electronics design inside out – device intelligence with or without hardware design 02/04/2008 - 15:32 ET Immunity simulation added to ApsimSPE 02/04/2008 - 08:54 ET LeCroy Expands QualiPHY Automated Compliance Solutions to Include Serial ATA, UltraWideband and PCI-Express Gen 1 02/04/2008 - 08:50 ET LeCroy Previews Leading Serial Data Solutions at DesignCon 2008 02/04/2008 - 08:00 ET Wipro-NewLogic is the first company to provide Bluetooth 2.1 + EDR IP ready for qualification 02/04/2008 - 08:00 ET LeCroy Corporation to Host Q&A Session Conducted by Dr. Howard Johnson 02/01/2008 - 09:00 ET Wipro Unveils Turnkey Semiconductor Service Framework For Design and Production of Low Cost, Reliable RF Integrated System-on-Chips 01/31/2008 - 08:00 ET Ethernet Alliance and other Professional Societies Partner with IEC at DesignCon 2008 Next Week in Santa Clara 01/22/2008 - 16:38 ET IEC's DesignCon 2008 Boasts Record Number of Exhibitors for New Year 01/22/2008 - 08:00 ET Japan's University of Tsukuba Selects Appro Xtreme-X Supercomputers for Next Generation High Performance Computing 01/16/2008 - 08:00 ET Industry Leaders Keynote at IEC's DesignCon 2008 in Silicon Valley Next Month 01/09/2008 - 12:04 ET DesignCon 2008 Press Invite 01/07/2008 - 13:29 ET IEC Announces 2008 DesignVision Award Finalists and Recognizes Best Design Tools and Products for New Year 12/11/2007 - 08:00 ET Appro Xtreme-X gets 2007 Product of the Year Award From SuperComputing Online 11/12/2007 - 08:00 ET Appro Reveals New Xtreme-X(tm) Supercomputer Series At Supercomputer 2007 10/02/2007 - 08:00 ET Appro wins Huge Deal with Three National Laboratories for 438 TeraFlop High Performance Computing Clusters ( 1 - 23 of 23 )

PRESS KITS DesignCon 2008 Altium Limited Applied Simulation Technology Appro International, Inc. Gore LeCroy Corporation Tektronix, Inc. Wipro Technologies ( 1 - 7 of 7 )